
High current carrying capacity: Due to the thick copper foil layer, thick copper FPCs can withstand higher current densities, making them suitable for applications that require high current transmission.
Good heat dissipation performance: A thicker copper foil layer facilitates rapid heat conduction and dissipation, thereby improving the heat dissipation performance of the circuit board.
Enhanced mechanical strength: The thick copper foil layer increases the overall mechanical strength of the circuit board, making it more durable and reliable.
Adapting to complex environments: Thick copper FPC still maintains the bendable and foldable characteristics of flexible circuit boards, and can adapt to various complex shapes and spatial layout requirements.
3、 Manufacturing process
4、 Application Fieldsmobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen